Dry-in/Dry-out
High process performance
High throughput capability
High operating rates
Multi step chemical cleaning capability
Polishing process end point monitor (option)
In-line film thickness monitor (option)
Diverse functions and flexible configuration
SEMI-S2/CE available
Model F-REX is a clean room-compatible CMP system for chemical mechanical polishing of wafer surfaces. Its high reliability and outstanding process performance have been demonstrated in the market, and it offers diverse and flexible configurations to meet every customer’s needs.
Dual-module system with no mutual contamination between process chambers. If one module stops, the other module start the operation automatically. This means that there is no need to shut down the entire unit for maintenance or trouble shooting, enabling high productivity. The dual-module system also facilitates multiple process treatment in one unit. Unit configurations that are ideal not only for mass production but also for testing and development are available.
Further improvement of production efficiency, high-performance & flexible CMP system
Achieves both high-throughput, high-speed plating and superior uniformity performance.
Fixed abrasive for excellent polish/removal performance, edge control function.