Precision Machinery Company's Strategic Table of Technological Capabilities

EBARA’s dry pumps are equipped with timing gear technology used to maintain the minute clearance between two rotors during their synchronous reverse rotation.

This technology is used to create a vacuum in dry pumps or turbomolecular pumps. A dry pump is a positive-displacement vacuum pump that does not use oil or liquid to seal the exhaust gas flow passage, thus creating a clean vacuum environment. In addition, longer pump life is achieved by optimizing the pump temperature and employing corrosion-resistant material engineering. EBARA also possesses technology which combines various vacuum equipment, piping, and vacuum pumps to produce pre-vacuum systems by utilizing tools such as exhaust simulations.

Technology for performing electroplating in the order of micrometers on various substrates for semiconductors. Plating with substrate uniformity performance is achieved through optimal control of the flow of plating solution and the electric field in the plating cell, and optimal combination of chemical solution, anode, and membrane.

EBARA’s CMP systems are equipped with technology to control the airflow in the system in order to reduce minute particles (foreign particles) adhering to the substrate after polishing and components that cause metal contamination. EBARA also possesses technology to control the airflow in the system taking the safety of workers into consideration, such as avoiding the external diffusion of polishing particles or chemical atmosphere contained in slurry and exposure to residual chemicals during maintenance work.

EBARA possesses technology for realizing non-contact, high-speed rotation in rotating machinery using magnetic bearings. EBARA also possesses technology for realizing stable rotation by sensing the rotor position and controlling the magnetic force of electromagnets.

The detection method is available in motor torque, optical type, and eddy current type, and EBARA possesses technology capable of detecting the CMP polishing end point by combining each method with various filters and algorithms. In wet environments where slurry flows, the residual film thickness of a substrate can be detected in the order of nanometers while the substrate is rotating.

EBARA has developed technology capable of generating ozone gas with high concentration and high flow rate through discharge, dissolving it at high concentrations in pure water, and supplying ozone water with concentration and flow rate to meet requirements.

EBARA possesses technology for abatement of perfluoro-compounds (PFCs), and combustible, acidic, toxic, and other gases by combustion, wet type process, dry type process, and fluorine fixation, gas analysis technologies, technologies for preventing powder clogging and corrosion in each part of the route from the reactor inlet to reactor interior to reactor outlet in exhaust abatement systems, and technologies for eliminating PM2.5 from treated gases.

EBARA also possesses technologies for induction canned motors, two-axis synchronous canned motors, and inverters.

EBARA has developed machining technology for cutting and drilling metal materials with tools. It is necessary to determine the optimum tool selection and cutting conditions, taking into account the material to be cut, the material shape, and dimensional tolerances. In particular, components used to create the pump vacuum must be of high machining accuracy and be suitable for mass production.

This technology achieves high productivity by maximizing the throughput of substrates that can be processed per unit time while minimizing and equalizing the transferring standby time when transferring substrates between processes in semiconductor manufacturing equipment. To achieve this, EBARA has developed software technology capable of throughput maximization simulations and scheduling substrate transferring and processing based on these simulations.